Broadcom-TOPPAN JV AST Completes Substrate Facility in Singapore
MT Newswires
Sep 29
Advanced Substrate Technologies, a joint venture between TOPPAN (TYO:7911) and Broadcom, opened its new manufacturing facility in Singapore, according to a Tuesday statement.
The facility is the city-state's first high-end flip chip ball grid array substrates producing facility, and has an area of 95,000 square meters.
The facility has been built to meet demand for generative AI and data centers and features sustainability elements.
the project was support by Singapore's Economic Development Board and JTC, with high-value manufacturing expected in late 2026.
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