INGENIC Semiconductor Co., Ltd. (SZSE: 300223; HKEX: 03223) reported strong interim results for the six months ended 30 June 2026, propelled by a robust global memory up-cycle and accelerating demand for AI-focused chips.
Key Financials • Revenue reached RMB 3.96 billion, up 75.9% year on year. • Profit attributable to shareholders jumped 489.6% to RMB 1.20 billion. • Gross margin rose 16.6 percentage points to 50.8%, aided by higher product pricing and favorable mix. • R&D expenses increased 9.7% to RMB 382.2 million; R&D ratio stood at 9.7% of revenue. • Cash and cash equivalents totaled RMB 3.95 billion at period-end; no interest-bearing debt reported. • Operating cash inflow amounted to RMB 959.0 million; net cash decreased by RMB 61.5 million after heavy investment in FVTPL products. • Interim dividend: none declared.
Segment Performance • Memory ICs: Revenue jumped 90.1% to RMB 2.63 billion, buoyed by stronger DRAM prices, tight supply and rising demand for NOR Flash in AI servers and optical modules. • Computing ICs: Sales climbed 72.7% to RMB 1.04 billion, supported by expanding edge-AI and smart security applications, despite raw-material shortages. • Analog ICs: Revenue advanced 10.6% to RMB 269.61 million, with growth in automotive lighting and IoT-related products. • Other income, mainly technical services and rental, contributed RMB 12.64 million.
Operational Highlights • “Memory + Computing + Analog” product strategy reinforced with new DDR4/LPDDR4, high-capacity NOR Flash, C-series vision SoCs, AI MCUs, and automotive LED driver ICs. • R&D focus areas include high-performance memory, RISC-V CPUs, neural network processors and AI ISP algorithms. • Equity-settled share incentives led to a charge of RMB 14.53 million during the period. • Inventory value reached RMB 3.14 billion; management tightened supply-chain allocation to navigate industry-wide capacity constraints. • No bank borrowings; gearing ratio at 9.2% (vs 8.0% at FY 2025).
Outlook Management expects the global memory super-cycle, edge-AI proliferation and automotive intelligence to sustain demand into H2 2026. The company plans continued investment in technology, product pipeline expansion, customer acquisition and capacity assurance to capture anticipated growth opportunities.
Subsequent Event On 25 August 2026, INGENIC completed its Hong Kong Main Board listing, issuing 31.29 million H Shares at HK$100.00 each, raising gross proceeds of HK$3.13 billion (approximately RMB 2.72 billion).