On September 22, FIT HON TENG rose 5.91% in regular trading, trading at 5.705 HKD/share, with turnover of 53.38 million HKD. The rally was driven by sustained strength across the optical communication and CPO (Co-Packaged Optics) sector, fueled by multiple catalysts in recent sessions.

On the news front, the optical communication sector has been buoyed by accelerating AI interconnect demand. Brokerage research reports indicate that AI-driven upgrades are pushing NPO/CPO technologies into broader Scale-Up market applications, with 800G and 1.6T high-speed optical module demand continuing to climb. Industry analysts note that optical-electrical integration is deepening, extending value across the supply chain toward optical engines, advanced packaging, and high-density optical connectivity components. Leading optical module manufacturers reportedly have order visibility extending into next year and beyond, with CPO technology viewed as a critical pathway for achieving ultra-high density and ultra-low power interconnection in Scale-Up networks.

Additionally, the finalization of FCC component-level regulatory rules has not restricted Chinese optical module enterprises, alleviating prior market concerns over policy risks and reinforcing the global AI optical interconnect supply chain's near-term reliance on China's manufacturing capabilities.

FIT HON TENG is a precision components supplier headquartered in Taiwan, with operations spanning consumer electronics accessories under the Belkin brand, focusing on smartphones, tablets, ultrabooks, and wearable devices.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)