LG Electronics has unveiled a modular solution that pre-assembles data center cooling equipment, including pumps and pipes, inside containers before supplying them to customers.

The advantage of this solution lies in its ability to reduce on-site construction work and to add cooling capacity in stages in line with server expansion needs.

At the 2026 Data Center Asia exhibition, which opened in Singapore on the 29th, LG Electronics showcased its "Hydronic Modular" solution for the first time.

Hydronic Modular pre-assembles equipment such as pumps and valves for circulating chilled water, emergency buffer tanks, and pipes inside containers built to International Organization for Standardization (ISO) container specifications.

At a data center site, a cooling system can be constructed simply by connecting the chiller unit itself to the container module via pipes.